i2c partners with Bond Financial Technologies to expand credit solutions

By Leandra Monteiro

i2c Inc., a provider of digital payment and banking technology, announced an expanded partnership with Bond Financial Technologies, Inc., an embedded finance platform, that brings access to credit for millions of Americans through Bond’s innovative Credit Builder Card and White Label Commercial Charge Card solutions, powered by i2c’s platform.

“We are proud to partner with Bond as they work to reimagine credit in new and innovative ways for embedded finance platforms to better serve their clients and their end users,” said Ava Kelly, chief product officer of i2c Inc. “With our configurable and global platform, Bond gains the ability to self-service programs for their clients, to easily and rapidly launch a wide-range of use cases.”

Powered by i2c’s agile SaaS platform, Bond’s Credit Builder Card allows businesses to offer a secured credit building program for their customers in a matter of weeks with approved customers being able to use their card wherever accepted. With consistent on-time payments, users will be able to improve their credit scores, enabling them to secure better interest rates on critical credit products such as home mortgages, auto loans and personal loans.

i2c also processes payments for Bond’s White Label Commercial Charge Card solution, in which customers can leverage Bond’s no-code platform to create personalised commercial credit products that help businesses of all sizes manage expenses, scale business, offer rewards, and tailor repayment schedules. These customers can then focus on growing their business while Bond manages their financial product solution.

“Bond is purpose-built to provide brands and banks the ability to compliantly launch and scale so that brands can provide exceptional customer experiences to their users,” said Roy Ng, CEO and co-founder of Bond. “With our credit products being backed by i2c’s processing platform, companies can build, launch, and scale credit programs with Bond quickly and seamlessly.”