International Schools Partnership & Postpay launch flexible payments for parents

By Leandra Monteiro

The International Schools Partnership (ISP) announced a new partnership with Postpay to support parents with Tuition fee payments.

Aimed at improving flexibility and budget management, ISP’s partnership with Postpay creates true value for parents at ISP Schools by providing a tuition fee payment option that is secure, easy-to-use and offers them the flexibility to pay in interest-free instalments.

Bharat Mansukhani, Divisional CEO for ISP Middle East and Europe said, “As a responsive education provider, the collaboration with Postpay is in line with our goal of supporting parents that choose our schools to provide their children with a high-quality, learning focused education.

Across the ISP community in the UAE, parents can now avail flexible and convenient payment plans to suit their budgets, enabling them to pay tuition fees in instalments throughout the academic year. As our partner in their child’s education, we hope this option is a tool that supports our parent community with their budget management.”

Tariq Sheikh, CEO and founder of Postpay said, “Postpay’s collaboration with the International Schools Partnership brings immense value to parents by empowering them with flexibility to pay later for tuition fees. We understand the importance of financial freedom, and our collaboration provides parents with a convenient and interest-free payment solution. By allowing parents to spread out their payments, we aim to alleviate financial burdens and ensure that families can provide their children with a high-quality education without compromising their financial wellbeing.”

Postpay is a Buy-Now-Pay-Later (BNPL) FinTech service provider that makes payments hassle-free and interest-free and provides a secure online payment option for its users. Under the partnership with ISP, Postpay will pay the total invoice amount to the school and families will repay the amount to PostPay in easy, interest-free instalments.