Cashfree Payments elevates leadership team to boost growth

By Leandra Monteiro

Cashfree Payments announced the elevation of Arun Tikoo as Chief Business Officer (CBO) and Ramkumar Venkatesan as Chief Technology Officer (CTO).

The appointments were announced by the company as it gears up for its next phase of growth. The changes in the leadership team are expected to help the company accelerate its innovation and growth. In addition, there have been additional internal promotions across roles in the organisation to support the company’s strategic plans.

Akash Sinha, Co-Founder & CEO, Cashfree Payments said, “At Cashfree Payments, we are at an exciting phase of growth and expansion and with the new appointments, I am sure that Ramkumar and Arun will help us in driving this growth at a rapid pace. They bring with them a wealth of knowledge, differentiated skills, and experience in the area of innovation, technology, Product, and Business. I am confident that we will be able to boost the operational functionality of current systems and develop new technological breakthroughs to improve the delivery of higher-quality services for our customers.”

Arun Tikoo, who was previously SVP-Business and Strategy, has been appointed as CBO. In his new role, Arun will be responsible for spearheading growth, partnerships, products, and expansion into newer markets. He will handle strategic partnerships, go-to-market plans, and will be responsible for the company’s development and growth, including market penetration and development on a global scale. Arun will also be responsible for strengthening the existing distribution network across industries and overseeing compliance, pricing, and operational setups of new product launches.

Ramkumar Venkatesan, who was previously SVP-Engineering, has been elevated to the position of CTO. In his new role, he will be responsible for leading the organisation’s technology, engineering, and innovation strategies, coordinating them with larger business objectives. He will be in charge of seamless technological and product integration, as well as the company’s infrastructure, security, engineering, and product development.